Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594524 | Fabrication and use of through silicon vias on double sided interconnect device | Brennen Mueller, Patrick Morrow, Kimin Jun, Paul B. Fischer | 2023-02-28 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11594524 | Fabrication and use of through silicon vias on double sided interconnect device | Brennen Mueller, Patrick Morrow, Kimin Jun, Paul B. Fischer | 2023-02-28 |