Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11594524 | Fabrication and use of through silicon vias on double sided interconnect device | Brennen Mueller, Patrick Morrow, Kimin Jun, Paul B. Fischer | 2023-02-28 | $10,430,000 |