MM

Myra McDonnell

IN Intel: 1 patents #1,763 of 4,378Top 45%
Overall (2023): #315,709 of 537,848Top 60%
1
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11721554 Stress compensation for wafer to wafer bonding Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Brennen Mueller, Mauro J. Kobrinsky 2023-08-08