| 11830831 |
Semiconductor package including a modular side radiating waveguide launcher |
Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Shawna M. Liff, Adel A. Elsherbini +1 more |
2023-11-28 |
| 11830787 |
Thermal management in integrated circuit packages |
Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-11-28 |
| 11784108 |
Thermal management in integrated circuit packages |
Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2023-10-10 |
| 11764452 |
Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity |
Georgios Dogiamis, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2023-09-19 |
| 11737154 |
Patch on interposer package with wireless communication interface |
— |
2023-08-22 |
| 11728290 |
Waveguide fan-out |
Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Henning Braunisch |
2023-08-15 |
| 11715693 |
Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture |
Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Henning Braunisch, Johanna M. Swan |
2023-08-01 |
| 11716826 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Johanna M. Swan, Georgios Dogiamis, Henning Braunisch, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2023-08-01 |
| 11694962 |
Microelectronic package with mold-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan |
2023-07-04 |
| 11688660 |
Bridge for radio frequency (RF) multi-chip modules |
Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan |
2023-06-27 |
| 11658418 |
Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems |
Feras Eid, Sasha N. Oster, Georgios Dogiamis, Aleksandar Aleksov |
2023-05-23 |
| 11652057 |
Disaggregated die interconnection with on-silicon cavity bridge |
Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Robert L. Sankman, Wil Choon Song +1 more |
2023-05-16 |
| 11641711 |
Microelectronic package with substrate-integrated components |
Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Johanna M. Swan |
2023-05-02 |
| 11621192 |
Inorganic dies with organic interconnect layers and related structures |
Aleksandar Aleksov, Feras Eid, Georgios Dogiamis, Johanna M. Swan |
2023-04-04 |
| 11605603 |
Microelectronic package with radio frequency (RF) chiplet |
Adel A. Elsherbini, Georgios Dogiamis, Henning Braunisch, Johanna M. Swan, Shawna M. Liff +1 more |
2023-03-14 |
| 11594801 |
Mmwave dielectric waveguide interconnect topology for automotive applications |
Georgios Dogiamis, Sasha N. Oster, Erich N. Ewy, Kenneth D. Shoemaker, Adel A. Elsherbini +1 more |
2023-02-28 |
| 11581272 |
Contactless high-frequency interconnect |
Henning Braunisch, Adel A. Elsherbini, Georgios Dogiamis, Richard J. Dischler, Johanna M. Swan +1 more |
2023-02-14 |
| 11575749 |
Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars |
Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Johanna M. Swan |
2023-02-07 |
| 11562971 |
Semiconductor packages with antennas |
Adel A. Elsherbini, Sasha N. Oster |
2023-01-24 |