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Home › Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device

US Patent 11716826 · Granted Aug 1, 2023

Estimated economic value: $26,467,000 ⓘ

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