Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith +1 more | 2023-10-31 |
| 11690165 | Package substrate inductor having thermal interconnect structures | Huong Do, Anne Augustine | 2023-06-27 |