KL

Kuan-Hsun Lu

IN Intel: 1 patents #1,763 of 4,378Top 45%
📍 New Taipei, AZ: #3 of 7 inventorsTop 45%
Overall (2023): #360,201 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11552035 Electronic package with stud bump electrical connections Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Omkar G. Karhade +1 more 2023-01-10