Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2023-07-18 |
| 11676900 | Electronic assembly that includes a bridge | Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2023-01-03 |