Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2023-07-18 | $21,060,000 |
| 11676900 | Electronic assembly that includes a bridge | Nitin A. Deshpande, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 | $22,204,000 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2023-01-03 | $15,575,000 |