Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao +5 more | 2023-11-28 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Nisha Ananthakrishnan +1 more | 2023-10-03 |