Issued Patents 2023
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688665 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-06-27 |
| 11676918 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Veronica Strong | 2023-06-13 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11652074 | Semiconductor package with improved thermal blocks | Feras Eid | 2023-05-16 |
| 11652059 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Lift, Gerald Pasdast | 2023-05-16 |
| 11641711 | Microelectronic package with substrate-integrated components | Georgios Dogiamis, Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing | 2023-05-02 |
| 11621208 | Thermal management solutions that reduce inductive coupling between stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-04-04 |
| 11621236 | Electrostatic discharge protection in integrated circuits using positive temperature coefficient material | Feras Eid, Veronica Strong, Aleksandar Aleksov, Adel A. Elsherbini | 2023-04-04 |
| 11621192 | Inorganic dies with organic interconnect layers and related structures | Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Georgios Dogiamis | 2023-04-04 |
| 11615998 | Thermal management solutions for embedded integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2023-03-28 |
| 11616047 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Shawna M. Liff | 2023-03-28 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Shawna M. Liff +1 more | 2023-03-14 |
| 11600594 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2023-03-07 |
| 11594801 | Mmwave dielectric waveguide interconnect topology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Kenneth D. Shoemaker +1 more | 2023-02-28 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Jimin Yao, Veronica Strong | 2023-02-14 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Adel A. Elsherbini, Shawna M. Liff, Gerald Pasdast | 2023-02-14 |
| 11581272 | Contactless high-frequency interconnect | Henning Braunisch, Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler +1 more | 2023-02-14 |
| 11575749 | Low-weight single mm-wave dielectric waveguide interconnect architecture in autonomous cars | Georgios Dogiamis, Sasha N. Oster, Adel A. Elsherbini, Erich N. Ewy, Telesphor Kamgaing | 2023-02-07 |
| 11569428 | Superconducting qubit device packages | Jeanette M. Roberts, Adel A. Elsherbini, Shawna M. Liff, Roman Caudillo, Zachary R. Yoscovits +4 more | 2023-01-31 |
| 11551551 | Technologies for providing guidance for autonomous vehicles in areas of low network connectivity | Nadine L. Dabby, Annie Foong, Karla Saur, Hassnaa Moustafa, Rita H. Wouhaybi +2 more | 2023-01-10 |