Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735551 | Aligned core balls for interconnect joint stability | Shawna M. Liff, Xin Yan, Numair Ahmed | 2023-08-22 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Chandra Mohan Jha | 2023-08-22 |
| 11581238 | Heat spreading layer integrated within a composite IC die structure and methods of forming the same | Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan, Veronica Strong | 2023-02-14 |