Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705417 | Backside metallization (BSM) on stacked die packages and external silicon at wafer level, singulated die level, or stacked dies level | Chandra Mohan Jha, Prasad Ramanathan, Xavier Francois Brun, Mark R. Allen | 2023-07-18 |