Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Kyle Arrington, Frederick Atadana, Minseok Ha | 2023-12-12 |
| 11710672 | Microelectronic package with underfilled sealant | Ken Hackenberg, Frederick Atadana, Elah Bozorg-Grayeli | 2023-07-25 |
| 11710677 | Ultraviolet (UV)-curable sealant in a microelectronic package | Ken Hackenberg, Elah Bozorg-Grayeli | 2023-07-25 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Ziyin Lin, Elizabeth Nofen, Vipul V. Mehta | 2023-06-13 |