Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842944 | IC assemblies including die perimeter frames suitable for containing thermal interface materials | Kyle Arrington, Taylor Gaines, Minseok Ha | 2023-12-12 |
| 11710672 | Microelectronic package with underfilled sealant | Taylor Gaines, Ken Hackenberg, Elah Bozorg-Grayeli | 2023-07-25 |