Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823994 | Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Eng Huat Goh, Min Suet Lim | 2023-11-21 |
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Eng Huat Goh, Poh Boon Khoo | 2023-07-11 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |
| 11658127 | RFI free picture frame metal stiffener | Eng Huat Goh, Khang Choong Yong, Boon Ping Koh, Wil Choon Song, Min Suet Lim | 2023-05-23 |
| 11587844 | Electronic device package on package (POP) | Eng Huat Goh, Min Suet Lim, Xi Guo | 2023-02-21 |