Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2023-07-11 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Eng Huat Goh, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |