Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728294 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Sujit Sharan, Jianyong Xie | 2023-08-15 |
| 11705390 | Variable in-plane signal to ground reference configurations | Arghya Sain | 2023-07-18 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2023-07-18 |
| 11621223 | Interconnect hub for dies | Sujit Sharan, Jianyong Xie | 2023-04-04 |
| 11610862 | Semiconductor packages with chiplets coupled to a memory device | Jianyong Xie | 2023-03-21 |
| 11569173 | Bridge hub tiling architecture | Digvijay A. Raorane, Wilfred Gomes, Ravindranath V. Mahajan, Sujit Sharan | 2023-01-31 |
| 11562993 | Embedded memory device and method for embedding memory device in a substrate | — | 2023-01-24 |