Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824515 | Acoustic wave device with spinel layer and temperature compensation layer | Gong Bin Tang, Rei Goto, Hiroyuki Nakamura | 2023-11-21 |
| 11804822 | Surface acoustic wave resonator with reduced frequency shift | Hironori Fukuhara, Yuya Hiramatsu | 2023-10-31 |
| 11784290 | Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device | — | 2023-10-10 |
| 11750172 | Multilayer piezoelectric substrate | Rei Goto, Gong Bin Tang | 2023-09-05 |
| 11722122 | Multilayer piezoelectric substrate with high density electrode | Rei Goto, Gong Bin Tang | 2023-08-08 |
| 11689178 | Acoustic wave device with multi-layer piezoelectric substrate | Hiroyuki Nakamura, Rei Goto | 2023-06-27 |
| 11677377 | Multi-layer piezoelectric substrate with grounding structure | Rei Goto | 2023-06-13 |
| 11671072 | Multi-layer piezoelectric substrate with conductive layer | Rei Goto | 2023-06-06 |
| 11664780 | Rayleigh mode surface acoustic wave resonator | Rei Goto | 2023-05-30 |
| 11621690 | Method of manufacturing acoustic wave device with multi-layer substrate including ceramic | Hironori Fukuhara, Rei Goto | 2023-04-04 |
| 11616487 | Acoustic wave devices on stacked die | Hiroyuki Nakamura, Rei Goto | 2023-03-28 |