Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11737227 | Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket | Zhichao Zhang, Gregorio R. Murtagian, Kemal Aygun | 2023-08-22 |
| 11569596 | Pressure features to alter the shape of a socket | Steven A. Klein, Srikant Nekkanty, Feroz Mohammad, Donald T. Tran, Srinivasa R. Aravamudhan +2 more | 2023-01-31 |