Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637050 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2023-04-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637050 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Mihir K. Roy | 2023-04-25 |