Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699629 | Integrated circuit die stacked with backer die including capacitors and thermal vias | Bror Peterson, Andrew Arthur Ketterson | 2023-07-11 |
| 11637050 | Package architecture utilizing wafer to wafer bonding | Robert Charles Dry, Mihir K. Roy | 2023-04-25 |