Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791312 | MMICs with backside interconnects for fanout-style packaging | Christo Bojkov | 2023-10-17 |
| 11699629 | Integrated circuit die stacked with backer die including capacitors and thermal vias | Anthony M. Chiu, Bror Peterson | 2023-07-11 |
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Tarak A. Railkar, Deep C. Dumka, Christo Bojkov | 2023-04-11 |
| 11557545 | Monolithic microwave integrated circuit (MMIC) with embedded transmission line (ETL) ground shielding | — | 2023-01-17 |