Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Christo Bojkov | 2023-04-11 |
| 11610814 | Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the same | — | 2023-03-21 |