Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11783998 | Process for making laminate substrate with sintered components | Deepukumar M. Nair, Jeffrey Dekosky | 2023-10-10 |
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Deep C. Dumka, Christo Bojkov | 2023-04-11 |
| 11551995 | Substrate with embedded active thermoelectric cooler | Mark C. Woods, Kelly M. Lear, Deepukumar M. Nair, Bradford Nelson | 2023-01-10 |