Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791312 | MMICs with backside interconnects for fanout-style packaging | Andrew Arthur Ketterson | 2023-10-17 |
| 11626340 | Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) | Kevin J. Anderson, Andrew Arthur Ketterson, Tarak A. Railkar, Deep C. Dumka | 2023-04-11 |