Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699629 | Integrated circuit die stacked with backer die including capacitors and thermal vias | Anthony M. Chiu, Andrew Arthur Ketterson | 2023-07-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699629 | Integrated circuit die stacked with backer die including capacitors and thermal vias | Anthony M. Chiu, Andrew Arthur Ketterson | 2023-07-11 |