Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Bernd Waidhas, Thomas Wagner | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Bernd Waidhas, Thomas Wagner | 2023-02-14 |