Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Georg Seidemann, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 | $20,015,000 |
| 11646288 | Integrating and accessing passive components in wafer-level packages | Gianni SIGNORINI, Veronica Sciriha | 2023-05-09 | $19,706,000 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Bernd Waidhas, Lizabeth Keser | 2023-02-14 | $12,790,000 |