Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Georg Seidemann, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 |
| 11646288 | Integrating and accessing passive components in wafer-level packages | Gianni SIGNORINI, Veronica Sciriha | 2023-05-09 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Bernd Waidhas, Lizabeth Keser | 2023-02-14 |