Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 | $20,015,000 |
| 11735570 | Fan out packaging pop mechanical attach method | David O'Sullivan, Georg Seidemann, Richard Patten | 2023-08-22 | $16,803,000 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Thomas Wagner, Lizabeth Keser | 2023-02-14 | $12,790,000 |