Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 |
| 11735570 | Fan out packaging pop mechanical attach method | David O'Sullivan, Georg Seidemann, Richard Patten | 2023-08-22 |
| 11581287 | Chip scale thin 3D die stacked package | Robert L. Sankman, Sanka Ganesan, Thomas Wagner, Lizabeth Keser | 2023-02-14 |