Issued Patents All Time
Showing 176–200 of 240 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9128123 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2015-09-08 |
| 9116203 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2015-08-25 |
| 9064705 | Methods and apparatus of packaging with interposers | Chung-Yu Lu, Hsien-Pin Hu, Hsiao-Tsung Yen, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2015-06-23 |
| 9054166 | Through silicon via keep out zone formation method and system | Cheng-Chieh Hsieh, Hung-An Teng, Shin-Puu Jeng | 2015-06-09 |
| 9048233 | Package systems having interposers | Wei-Cheng Wu, Shin-Puu Jeng, Chen-Hua Yu | 2015-06-02 |
| 9048231 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2015-06-02 |
| 9040381 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Shuo-Mao Chen, Chiung-Han Yeh, Yi-Jou Lin | 2015-05-26 |
| 9034695 | Integrated thermal solutions for packaging integrated circuits | Cheng-Chieh Hsieh, Shin-Puu Jeng | 2015-05-19 |
| 8993432 | Test structure and method of testing electrical characteristics of through vias | Wei-Cheng Wu, Hsien-Pin Hu, Jung Cheng Ko, Shin-Puu Jeng, Chen-Hua Yu +1 more | 2015-03-31 |
| 8993380 | Structure and method for 3D IC package | Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu | 2015-03-31 |
| 8993355 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shin-Puu Jeng, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2015-03-31 |
| 8937389 | Semiconductor devices comprising GSG interconnect structures | Christianto Chih-Ching Liu, Shuo-Mao Chen, Der-Chyang Yeh, Shin-Puu Jeng | 2015-01-20 |
| 8901735 | Connector design for packaging integrated circuits | Chen-Hua Yu, Ying-Ching Shih, Po-Hao Tsai, Chin-Fu Kao, Cheng-Lin Huang +4 more | 2014-12-02 |
| 8896089 | Interposers for semiconductor devices and methods of manufacture thereof | Tzu-Wei Chiu, Tzu-Yu Wang, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu | 2014-11-25 |
| 8878182 | Probe pad design for 3DIC package yield analysis | Tzu-Yu Wang, Chen-Hua Yu, Shin-Puu Jeng, Hsien-Pin Hu, Wei-Cheng Wu +2 more | 2014-11-04 |
| 8878338 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Wen-Chih Chiou +1 more | 2014-11-04 |
| 8872345 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shin-Puu Jeng | 2014-10-28 |
| 8865521 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2014-10-21 |
| 8860208 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng +1 more | 2014-10-14 |
| 8836094 | Package device including an opening in a flexible substrate and methods of forming the same | Tsung-Shu Lin, Cheng-Chieh Hsieh, Hung-An Teng, Sao-Ling Chiu | 2014-09-16 |
| 8810006 | Interposer system and method | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh | 2014-08-19 |
| 8802504 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2014-08-12 |
| 8797057 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2014-08-05 |
| 8765549 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Shin-Puu Jeng, Der-Chyang Yeh, Wen-Chih Chiou | 2014-07-01 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2014-06-24 |