SH

Shang-Yun Hou

TSMC: 238 patents #52 of 12,232Top 1%
AT AT&T: 1 patents #10,626 of 18,772Top 60%
WM Worldwide Semiconductor Manufacturing: 1 patents #30 of 58Top 55%
📍 Wubei, NJ: #1 of 1 inventorsTop 100%
Overall (All Time): #2,209 of 4,157,543Top 1%
240
Patents All Time

Issued Patents All Time

Showing 226–240 of 240 patents

Patent #TitleCo-InventorsDate
7811866 Single passivation layer scheme for forming a fuse Hao-Yi Tsai, Anbiarshy Wu, Chia-Lun Tsai, Shin-Puu Jeng 2010-10-12
7776627 Flexible structures for interconnect reliability test Shin-Puu Jeng, Hao-Yi Tsai, Anbiarshy Wu 2010-08-17
7714443 Pad structure design with reduced density Hsien-Wei Chen, Anbiarshy Wu, Shih-Hsun Hsu, Hsueh-Chung Chen, Shin-Puu Jeng 2010-05-11
7651893 Metal electrical fuse structure Hsueh-Chung Chen, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng 2010-01-26
7602065 Seal ring in semiconductor device Chun-Hung Chen, Chia-Lun Tsai, Pao-Kang Niu, Shin-Puu Jeng 2009-10-13
7449785 Solder bump on a semiconductor substrate Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Chia-Lun Tsai 2008-11-11
7446398 Bump pattern design for flip chip semiconductor package Pao-Kang Niu, Pei-Haw Tsao, Hao-Yi Tsai, Yung Kuan Hsiao, Chung Yu Wang +1 more 2008-11-04
7397106 Laser fuse with efficient heat dissipation Hao-Yi Tsai, Chao-Hsiang Yang, Chia-Lun Tsai, Shin-Puu Jeng 2008-07-08
7364998 Method for forming high reliability bump structure Sung-Cheng Chiu, Hao-Yi Tsai, Hsiu-Mei Yu, Shih-Ming Chen 2008-04-29
7205588 Metal fuse for semiconductor devices Shin-Puu Jeng, Chi-Hsi Wu 2007-04-17
6854100 Methodology to characterize metal sheet resistance of copper damascene process Harry Chuang, Victor Chih Yuan Chang, Yung-Shun Chen 2005-02-08
6777318 Aluminum/copper clad interconnect layer for VLSI applications Shin-Puu Jeng 2004-08-17
6753210 Metal fuse for semiconductor devices Shin-Puu Jeng, Chi-Hsi Wu 2004-06-22
5981386 Method for manufacturing interconnection plug Ching-Yuan Ho 1999-11-09
5948216 Method for making thin film tantalum oxide layers with enhanced dielectric properties and capacitors employing such layers Robert J. Cava, Jueinai Kwo, Eric W. Seelig, Roderick K. Watts 1999-09-07