Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9121891 | Apparatus and methods for de-embedding through substrate vias | Hsiao-Tsung Yen, Min-Chie Jeng, Chin-Wei Kuo, Yu-Ling Lin | 2015-09-01 |
| 8809073 | Apparatus and methods for de-embedding through substrate vias | Hsiao-Tsung Yen, Yu-Ling Lin, Chin-Wei Kuo, Min-Chie Jeng | 2014-08-19 |
| 8115500 | Accurate capacitance measurement for ultra large scale integrated circuits | Yih-Yuh Doong, Keh-Jeng Chang, Yuh-Jier Mii, Sally Liu, Lien Jung Hung | 2012-02-14 |
| 7880494 | Accurate capacitance measurement for ultra large scale integrated circuits | Yih-Yuh Doong, Keh-Jeng Chang, Yuh-Jier Mii, Sally Liu, Lien Jung Hung | 2011-02-01 |
| 7772868 | Accurate capacitance measurement for ultra large scale integrated circuits | Yih-Yuh Doong, Keh-Jeng Chang, Yuh-Jier Mii, Sally Liu, Lien Jung Hung | 2010-08-10 |
| 7028277 | Process related deviation corrected parasitic capacitance modeling method | Chung-Shi Chiang, Chien-Wen Chen, Harry Chuang, Hsin-Yi Lee, Yu-Tai Chia | 2006-04-11 |
| 6854100 | Methodology to characterize metal sheet resistance of copper damascene process | Harry Chuang, Yung-Shun Chen, Shang-Yun Hou | 2005-02-08 |