Issued Patents All Time
Showing 201–225 of 240 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2014-06-17 |
| 8716867 | Forming interconnect structures using pre-ink-printed sheets | Francis Ko, Chi-Chun Hsieh, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-05-06 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu +2 more | 2014-04-08 |
| 8680647 | Packages with passive devices and methods of forming the same | Chen-Hua Yu, Der-Chyang Yeh, Shuo-Mao Chen, Chiung-Han Yeh, Yi-Jou Lin | 2014-03-25 |
| 8664760 | Connector design for packaging integrated circuits | Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chieh Hsieh, Kuo-Ching Hsu, Ying-Ching Shih +4 more | 2014-03-04 |
| 8643147 | Seal ring structure with improved cracking protection and reduced problems | Shin-Puu Jeng, Shih-Hsun Hsu, Hao-Yi Tsai, Chen-Hua Yu | 2014-02-04 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Kuo-Ching Hsu, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2013-12-17 |
| 8604619 | Through silicon via keep out zone formation along different crystal orientations | Cheng-Chieh Hsieh, Hung-An Teng, Shin-Puu Jeng | 2013-12-10 |
| 8575717 | Integrated circuit device and method of manufacturing the same | Der-Chyang Yeh | 2013-11-05 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Chen-Hua Yu, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2013-10-15 |
| 8519537 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2013-08-27 |
| 8519512 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shin-Puu Jeng, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2013-08-27 |
| 8368180 | Scribe line metal structure | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Ming-Yen Chiu | 2013-02-05 |
| 8334582 | Protective seal ring for preventing die-saw induced stress | Shin-Puu Jeng, Hsien-Wei Chen, Hao-Yi Tsai, Anbiarshy Wu, Yu-Wen Liu | 2012-12-18 |
| 8319349 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2012-11-27 |
| 8283781 | Semiconductor device having pad structure with stress buffer layer | Wei-Cheng Wu, Shin-Puu Jeng, Tzuan-Horng Liu, Tzu-Wei Chiu, Chao-Wen Shih | 2012-10-09 |
| 8227917 | Bond pad design for fine pitch wire bonding | Shih-Hsun Hsu, Hao-Yi Tsai, Benson Liu, Chia-Lun Tsai, Hsien-Wei Chen +2 more | 2012-07-24 |
| 8193639 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shin-Puu Jeng, Wei-Cheng Wu, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2012-06-05 |
| 8125052 | Seal ring structure with improved cracking protection | Shin-Puu Jeng, Shih-Hsun Hsu, Hao-Yi Tsai, Chen-Hua Yu | 2012-02-28 |
| 8105875 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2012-01-31 |
| 8072076 | Bond pad structures and integrated circuit chip having the same | Shih-Hsun Hsu, Shih-Puu Jeng, Hsien-Wei Chen | 2011-12-06 |
| 8030776 | Integrated circuit with protective structure | Chen-Hua Yu, Shin-Puu Jeng, Hao-Yi Tsai, Hsien-Wei Chen, Hsiu-Ping Wei | 2011-10-04 |
| 7952167 | Scribe line layout design | Hsin-Hui Lee, Mirng-Ji Lii, Shin-Puu Jeng | 2011-05-31 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Shin-Puu Jeng +1 more | 2011-03-15 |
| 7888236 | Semiconductor device and fabrication methods thereof | Han-Ping Pu, Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching +3 more | 2011-02-15 |