Issued Patents All Time
Showing 1,351–1,375 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9373755 | Light-emitting diodes on concave texture substrate | Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu | 2016-06-21 |
| 9372206 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2016-06-21 |
| 9373527 | Chip on package structure and method | Der-Chyang Yeh, Kuo-Chung Yee, Jui-Pin Hung | 2016-06-21 |
| 9373604 | Interconnect structures for wafer level package and methods of forming same | Chung-Shi Liu | 2016-06-21 |
| 9373605 | DIE packages and methods of manufacture thereof | Chuei-Tang Wang | 2016-06-21 |
| 9368460 | Fan-out interconnect structure and method for forming same | Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu, Chien Ling Hwang +2 more | 2016-06-14 |
| 9368454 | Semiconductor device with shielding layer in post-passivation interconnect structure | Chung-Hao Tsai, Wei-Chih Lai, Chuei-Tang Wang | 2016-06-14 |
| 9362197 | Molded underfilling for package on package devices | Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang, Ming-Da Cheng, Yung Ching Chen | 2016-06-07 |
| 9362164 | Hybrid interconnect scheme and methods for forming the same | Tien-I Bao | 2016-06-07 |
| 9355978 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Tsung-Yuan Yu, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-31 |
| 9355956 | Inductor for semiconductor integrated circuit | Hao-Hsiang Chuang, Jeng-Shien Hsieh, Chuei-Tang Wang | 2016-05-31 |
| 9349701 | Self-aligning conductive bump structure and method of fabrication | Cheng-Lin Huang, I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu +2 more | 2016-05-24 |
| 9343433 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii | 2016-05-17 |
| 9343419 | Bump structures for semiconductor package | Meng-Liang Lin, Jy-Jie Gau, Cheng-Lin Huang, Jing-Cheng Lin, Kuo-Ching Hsu | 2016-05-17 |
| 9337073 | 3D shielding case and methods for forming the same | Monsen Liu, Chuei-Tang Wang, Lai Wei Chih | 2016-05-10 |
| 9331021 | Chip-on-wafer package and method of forming same | Ming-Fa Chen, Sung-Feng Yeh | 2016-05-03 |
| 9331018 | Semiconductor arrangement and formation thereof | Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang | 2016-05-03 |
| 9324756 | CIS chips and methods for forming the same | Wen-Chih Chiou, Jing-Cheng Lin | 2016-04-26 |
| 9324698 | Multi-chip structure and method of forming same | Der-Chyang Yeh | 2016-04-26 |
| 9324587 | Method for manufacturing semiconductor structure | Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2016-04-26 |
| 9312225 | Bump structure for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou | 2016-04-12 |
| 9312149 | Method for forming chip-on-wafer assembly | Jing-Cheng Lin, Cheng-Lin Huang, Szu-Wei Lu, Jui-Pin Hung, Shin-Puu Jeng | 2016-04-12 |
| 9305877 | 3D package with through substrate vias | Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9305769 | Thin wafer handling method | Wen-Chih Chiou, Shin-Puu Jeng, Hung-Jung Tu | 2016-04-05 |
| 9299612 | Stacked structures and methods of forming stacked structures | Weng-Jin Wu, Wen-Chih Chiou | 2016-03-29 |