Issued Patents All Time
Showing 1–25 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369399 | Gate-to-gate isolation for stacked transistor architecture via selective dielectric deposition structure | Willy Rachmady, Sudipto Naskar, Cheng-Ying Huang, Gilbert Dewey, Marko Radosavljevic +2 more | 2025-07-22 |
| 12342614 | Asymmetric gate structures and contacts for stacked transistors | Cheng-Ying Huang, Arunshankar Venkataraman, Sean T. Ma, Willy Rachmady, Nicole K. Thomas +2 more | 2025-06-24 |
| 12310044 | Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices | Rishabh Mehandru, Ranjith Kumar, Cory E. Weber, Seiyon Kim, Stephen M. Cea +1 more | 2025-05-20 |
| 12288810 | Backside contact structures and fabrication for metal on both sides of devices | Rishabh Mehandru, Aaron D. Lilak, Kimin Jun | 2025-04-29 |
| 12255137 | Sideways vias in isolation areas to contact interior layers in stacked devices | Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +3 more | 2025-03-18 |
| 12224202 | Forming an oxide volume within a fin | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more | 2025-02-11 |
| 12199143 | Gate-all-around integrated circuit structures having removed substrate | Biswajeet Guha, Mauro J. Kobrinsky, Oleg Golonzka, Tahir Ghani | 2025-01-14 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +3 more | 2024-12-24 |
| 12148806 | Stacked source-drain-gate connection and process for forming such | Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +2 more | 2024-11-19 |
| 12107085 | Interconnect techniques for electrically connecting source/drain regions of stacked transistors | Aaron D. Lilak, Gilbert Dewey, Cheng-Ying Huang, Christopher J. Jezewski, Ehren Mannebach +4 more | 2024-10-01 |
| 12100762 | Wrap-around source/drain method of making contacts for backside metals | Kimin Jun, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12100761 | Wrap-around source/drain method of making contacts for backside metals | Kimin Jun, Il-Seok Son, Donald W. Nelson | 2024-09-24 |
| 12100623 | Vertically stacked finFETs and shared gate patterning | Aaron D. Lilak, Sean T. Ma, Justin R. Weber, Rishabh Mehandru, Stephen M. Cea +1 more | 2024-09-24 |
| 12080605 | Backside contacts for semiconductor devices | Aaron D. Lilak, Ehren Mannebach, Anh Phan, Richard E. Schenker, Stephanie A. Bojarski +4 more | 2024-09-03 |
| 12057494 | Stacked transistors | Rishabh Mehandru, Aaron D. Lilak | 2024-08-06 |
| 12051723 | PN-body-tied field effect transistors | Aaron D. Lilak, Kerryann Marrietta Foley, Sayed Hasan, Willy Rachmady | 2024-07-30 |
| 12020929 | Epitaxial layer with substantially parallel sides | Cheng-Ying Huang, Gilbert Dewey, Jack T. Kavalieros, Aaron D. Lilak, Ehren Mannebach +3 more | 2024-06-25 |
| 11996362 | Integrated circuit device with crenellated metal trace layout | Mauro J. Kobrinsky, Mark Bohr, Tahir Ghani, Rishabh Mehandru, Ranjith Kumar | 2024-05-28 |
| 11996411 | Stacked forksheet transistors | Cheng-Ying Huang, Gilbert Dewey, Anh Phan, Nicole K. Thomas, Urusa Alaan +8 more | 2024-05-28 |
| 11990899 | Multi-level spin logic | Sasikanth Manipatruni, Ian A. Young, Dmitri E. Nikonov, Uygar E. Avci, Anurag Chaudhry | 2024-05-21 |
| 11948874 | Vertically spaced intra-level interconnect line metallization for integrated circuit devices | Kevin Lin, Sukru YEMENICIOGLU, Richard E. Schenker, Mauro J. Kobrinsky | 2024-04-02 |
| 11948831 | Apparatus with multi-wafer based device and method for forming such | Anup Pancholi, Prashant Majhi, Paul B. Fischer | 2024-04-02 |
| 11942526 | Integrated circuit contact structures | Glenn A. Glass, Anand S. Murthy, Rishabh Mehandru | 2024-03-26 |
| 11942416 | Sideways vias in isolation areas to contact interior layers in stacked devices | Ehren Mannebach, Aaron D. Lilak, Hui Jae Yoo, Anh Phan, Willy Rachmady +3 more | 2024-03-26 |
| 11935933 | Backside contact structures and fabrication for metal on both sides of devices | Rishabh Mehandru, Aaron D. Lilak, Kimin Jun | 2024-03-19 |