Issued Patents All Time
Showing 126–150 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Gangadhara Raja Muthinti, Cornelius Brown Peethala | 2021-08-24 |
| 11094637 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Steven L. Wright | 2021-08-17 |
| 11083837 | Secure medication delivery | Ira L. Allen, Gregory J. Boss, Andrew R. Jones, Kevin C. McConnell, John E. Moore, Jr. | 2021-08-10 |
| 11069564 | Double metal patterning | Hsueh-Chung Chen, Yongan Xu, Yann Mignot, James J. Kelly | 2021-07-20 |
| 11068896 | Granting requests for authorization using data of devices associated with requestors | Spyridon Skordas, Richard C. Johnson | 2021-07-20 |
| 11063089 | Resistive memory device with meshed electrodes | Takashi Ando, Chih-Chao Yang, Michael Rizzolo | 2021-07-13 |
| 11062993 | Contacts having a geometry to reduce resistance | Baozhen Li, Kirk D. Peterson, Terry A. Spooner, Junli Wang | 2021-07-13 |
| 11062943 | Top via interconnects with wrap around liner | Koichi Motoyama, Nicholas Anthony Lanzillo, Christopher J. Penny, Somnath Ghosh, Robert R. Robison | 2021-07-13 |
| 11056429 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2021-07-06 |
| 11049744 | Optimizing semiconductor binning by feed-forward process adjustment | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis | 2021-06-29 |
| 11049727 | Interleaved structure for molecular manipulation | Shawn P. Fetterolf, Donald F. Canaperi, Kangguo Cheng | 2021-06-29 |
| 11043494 | Structure and method for equal substrate to channel height between N and P fin-FETs | Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve, Fee Li Lie, Deepika Priyadarshini +2 more | 2021-06-22 |
| 11024551 | Metal replacement vertical interconnections for buried capacitance | Hsueh-Chung Chen, Daniel James Dechene, Somnath Ghosh, Carl Radens | 2021-06-01 |
| 11018090 | Selective CVD alignment-mark topography assist for non-volatile memory | Michael Rizzolo, Chih-Chao Yang, Benjamin D. Briggs | 2021-05-25 |
| 11018007 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2021-05-25 |
| 11004790 | Method of manufacturing an interconnect without dielectric exclusion zones by thermal decomposition of a sacrificial filler material | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2021-05-11 |
| 11004736 | Integrated circuit having a single damascene wiring network | Hsueh-Chung Chen, Junli Wang, Somnath Ghosh, Chih-Chao Yang | 2021-05-11 |
| 10998193 | Spacer-assisted lithographic double patterning | Timothy Mathew Philip, Somnath Ghosh, Daniel James Dechene, Robert R. Robison | 2021-05-04 |
| 10991619 | Top via process accounting for misalignment by increasing reliability | Chen Zhang, Benjamin D. Briggs, Brent A. Anderson, Chih-Chao Yang | 2021-04-27 |
| 10985063 | Semiconductor device with local connection | Kangguo Cheng, Carl Radens, Junli Wang, John H. Zhang | 2021-04-20 |
| 10978393 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo | 2021-04-13 |
| 10978343 | Interconnect structure having fully aligned vias | Chanro Park, Nicholas Anthony Lanzillo, Christopher J. Penny, Balasubramanian Pranatharthiharan | 2021-04-13 |
| 10971030 | Remote physical training | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2021-04-06 |
| 10964588 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Michael Rizzolo, Hosadurga Shobha | 2021-03-30 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2021-03-23 |