Issued Patents All Time
Showing 76–100 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302571 | Cut integration for subtractive first metal line with bottom up second metal line | Somnath Ghosh, Hsueh-Chung Chen, Yongan Xu, Yann Mignot | 2022-04-12 |
| 11302205 | Language learning and speech enhancement through natural language processing | Mahmoud Amin, Zhenxing Bi, Leigh Anne H. Clevenger, Christopher J. Penny, Krishna R. Tunga +1 more | 2022-04-12 |
| 11295985 | Forming a backside ground or power plane in a stacked vertical transport field effect transistor | Chen Zhang, Tenko Yamashita, Kangguo Cheng | 2022-04-05 |
| 11295978 | Interconnects having spacers for improved top via critical dimension and overlay tolerance | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2022-04-05 |
| 11289371 | Top vias with selectively retained etch stops | Brent A. Anderson, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison | 2022-03-29 |
| 11283015 | Projected phase change memory devices | Timothy Mathew Philip, Nicole Saulnier | 2022-03-22 |
| 11276639 | Conductive lines with subtractive cuts | Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison | 2022-03-15 |
| 11276636 | Adjustable via dimension and chamfer angle | Koichi Motoyama, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Benjamin D. Briggs, Michael Rizzolo | 2022-03-15 |
| 11276611 | Top via on subtractively etched conductive line | Brent A. Anderson, Kisik Choi, Nicholas Anthony Lanzillo, Christopher J. Penny, Robert R. Robison | 2022-03-15 |
| 11263068 | Proximity correction in three-dimensional manufacturing | Benjamin D. Briggs, Leigh Anne H. Clevenger, Christopher J. Penny, Michael Rizzolo, Aldis Sipolins | 2022-03-01 |
| 11244859 | Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line | Koichi Motoyama, Cornelius Brown Peethala, Christopher J. Penny, Nicholas Anthony Lanzillo | 2022-02-08 |
| 11232977 | Stepped top via for via resistance reduction | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2022-01-25 |
| 11227796 | Enhancement of iso-via reliability | Baozhen Li, Xiao Hu Liu, Kirk D. Peterson | 2022-01-18 |
| 11227793 | Self-aligned pattern formation for a semiconductor device | Sean D. Burns, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier | 2022-01-18 |
| 11217481 | Fully aligned top vias | Nicholas Anthony Lanzillo, Koichi Motoyama, Somnath Ghosh, Christopher J. Penny, Robert R. Robison | 2022-01-04 |
| 11210968 | Behavior-based interactive educational sessions | Stefania Axo, Leigh Anne H. Clevenger, Krishna R. Tunga, Mahmoud Amin, Bryan Gury +4 more | 2021-12-28 |
| 11199505 | Machine learning enhanced optical-based screening for in-line wafer testing | Robin Hsin Kuo Chao, Mary Breton, Huai Huang, Dexin Kong | 2021-12-14 |
| 11195993 | Encapsulation topography-assisted self-aligned MRAM top contact | Michael Rizzolo, Nicholas Anthony Lanzillo, Benjamin D. Briggs | 2021-12-07 |
| 11195795 | Well-controlled edge-to-edge spacing between adjacent interconnects | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2021-12-07 |
| 11195792 | Top via stack | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2021-12-07 |
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Dongbing Shao, Shyng-Tsong Chen, Hao Tang, Jing Sha | 2021-11-30 |
| 11189568 | Top via interconnect having a line with a reduced bottom dimension | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2021-11-30 |
| 11185658 | Internet of things (IOT) real-time response to defined symptoms | Mahmoud Amin, Krishna R. Tunga, Zhenxing Bi, Leigh Anne H. Clevenger | 2021-11-30 |
| 11182722 | Cognitive system for automatic risk assessment, solution identification, and action enablement | Alex Richard Hubbard, Spyridon Skordas, Marc A. Bergendahl, Cody J. Murray, Gauri Karve | 2021-11-23 |
| 11177166 | Etch stop layer removal for capacitance reduction in damascene top via integration | Christopher J. Penny, Brent A. Anderson, Robert R. Robison, Kisik Choi, Nicholas Anthony Lanzillo | 2021-11-16 |