Issued Patents All Time
Showing 51–75 of 635 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744981 | Internet of things (IoT) real-time response to defined symptoms | Mahmoud Amin, Krishna R. Tunga, Zhenxing Bi, Leigh Anne H. Clevenger | 2023-09-05 |
| 11738995 | Manipulation of a molecule using dipole moments | Shawn P. Fetterolf, Donald F. Canaperi, Kangguo Cheng | 2023-08-29 |
| 11735524 | Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo | 2023-08-22 |
| 11682617 | High aspect ratio vias for integrated circuits | Nicholas Anthony Lanzillo, Somnath Ghosh, Robert R. Robison | 2023-06-20 |
| 11676854 | Selective ILD deposition for fully aligned via with airgap | Christopher J. Penny, Benjamin D. Briggs, Huai Huang, Michael Rizzolo, Hosadurga Shobha | 2023-06-13 |
| 11670542 | Stepped top via for via resistance reduction | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2023-06-06 |
| 11670510 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2023-06-06 |
| 11646221 | Self-aligned pattern formation for a semiconductor device | Sean D. Burns, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny, Nicole Saulnier | 2023-05-09 |
| 11636353 | Cognitive system for localized LIDAR pollution detection using autonomous vehicles | Benjamin D. Briggs, Leigh Anne H. Clevenger, Michael Rizzolo | 2023-04-25 |
| 11621189 | Barrier-less prefilled via formation | Nicholas Anthony Lanzillo, Hosadurga Shobha, Junli Wang, Christopher J. Penny, Robert R. Robison +1 more | 2023-04-04 |
| 11610941 | Integrated non volatile memory electrode thin film resistor cap and etch stop | Kevin W. Brew, Takashi Ando, Michael Rizzolo | 2023-03-21 |
| 11600565 | Top via stack | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2023-03-07 |
| 11574735 | Authentication of medication delivery vehicle to facilitate medication release | Ira L. Allen, Gregory J. Boss, Andrew R. Jones, Kevin C. McConnell, John E. Moore, Jr. | 2023-02-07 |
| 11574875 | Multi-chip package structures having embedded chip interconnect bridges and fan-out redistribution layers | Joshua M. Rubin, Steven L. Wright | 2023-02-07 |
| 11574864 | Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device | Benjamin D. Briggs, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo | 2023-02-07 |
| 11538720 | Stacked transistors with different channel widths | Kangguo Cheng, Balasubramanian Pranatharthiharan, John H. Zhang | 2022-12-27 |
| 11495538 | Fully aligned via for interconnect | Ruilong Xie, Christopher J. Waskiewicz, Chih-Chao Yang, Ashim Dutta | 2022-11-08 |
| 11437317 | Single-mask alternating line deposition | Brent A. Anderson, Christopher J. Penny, Kisik Choi, Nicholas Anthony Lanzillo, Robert R. Robison | 2022-09-06 |
| 11430735 | Barrier removal for conductor in top via integration scheme | Brent A. Anderson, Nicholas Anthony Lanzillo, Christopher J. Penny, Kisik Choi, Robert R. Robison | 2022-08-30 |
| 11430651 | Nanosheet transistors with sharp junctions | Kangguo Cheng, Balasubramanian S. Pranatharthi Haran, John H. Zhang | 2022-08-30 |
| 11380583 | Forming self-aligned vias and air-gaps in semiconductor fabrication | Carl Radens, John H. Zhang | 2022-07-05 |
| 11348060 | Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather | Benjamin D. Briggs, Leigh Anne H. Clevenger, Aldis Sipolins, Michael Rizzolo, Christopher J. Penny | 2022-05-31 |
| 11348872 | Hybrid dielectric scheme for varying liner thickness and manganese concentration | Benjamin D. Briggs, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo | 2022-05-31 |
| 11315827 | Skip via connection between metallization levels | Huai Huang, Hosadurga Shobha, Christopher J. Penny, Nicholas Anthony Lanzillo | 2022-04-26 |
| 11302575 | Subtractive line with damascene second line type | Brent A. Anderson, Christopher J. Penny, Nicholas Anthony Lanzillo, Kisik Choi, Robert R. Robison | 2022-04-12 |