Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816464 | Imaging reflectometer | Guoheng Zhao, Mehdi Vaez-Iravani | 2020-10-27 |
| 10793954 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2020-10-06 |
| 10736182 | Apparatus, systems, and methods for temperature control of substrates using embedded fiber optics and epoxy optical diffusers | Matthew J. Busche, Wendell Glenn Boyd, Jr., Gregory L. Kirk, Vijay D. Parkhe, Michael R. Rice +1 more | 2020-08-04 |
| 10710307 | Temperature control for additive manufacturing | David Masayuki Ishikawa, Paul J. Steffas | 2020-07-14 |
| 10695804 | Equipment cleaning apparatus and method | Roman Mostovoy, Suketu Arun Parikh | 2020-06-30 |
| 10527407 | In-situ metrology method for thickness measurement during PECVD processes | Khokan Chandra Paul, Edward W. Budiarto, Mehdi Vaez-Iravani, Jeongmin Lee, Dale R. Du Bois +1 more | 2020-01-07 |
| 10522375 | Monitoring system for deposition and method of operation thereof | Edward W. Budiarto, Majeed A. Foad, Ralf Hofmann, Thomas Nowak, Mehdi Vaez-Iravani | 2019-12-31 |
| 10510624 | Metrology systems with multiple derivative modules for substrate stress and deformation measurement | Mehdi Vaez-Iravani, Samer Banna, Kyle Tantiwong | 2019-12-17 |
| 10281261 | In-situ metrology method for thickness measurement during PECVD processes | Khokan Chandra Paul, Edward W. Budiarto, Mehdi Vaez-Iravani, Jeongmin Lee, Dale R. Du Bois +1 more | 2019-05-07 |
| 10260855 | Electroplating tool with feedback of metal thickness distribution and correction | Edward W. Budiarto, Robert O. Miller, Abraham Ravid, Bridger Earl HOERNER, Robert W. Batz, Jr. +1 more | 2019-04-16 |
| 10234261 | Fast and continuous eddy-current metrology of a conductive film | Edward W. Budiarto, Dmitry A. Dzilno, Jeffrey C. Hudgens, Nir Merry | 2019-03-19 |
| 10217650 | Methods and apparatus for substrate edge cleaning | James M. Holden, Song-Moon Suh, Kalyanjit Ghosh, Leon Volfovski, Michael R. Rice +1 more | 2019-02-26 |
| 10196741 | Wafer placement and gap control optimization through in situ feedback | Kevin Griffin, Abraham Ravid, Alex Minkovich, Somesh Khandelwal, Joseph Yudovsky | 2019-02-05 |
| 10112259 | Damage isolation by shaped beam delivery in laser scribing process | James M. Holden, Nir Merry | 2018-10-30 |
| 10060032 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2018-08-28 |
| 10030306 | PECVD apparatus and process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2018-07-24 |
| 9870935 | Monitoring system for deposition and method of operation thereof | Edward W. Budiarto, Majeed A. Foad, Ralf Hofmann, Thomas Nowak, Mehdi Vaez-Iravani | 2018-01-16 |
| 9816187 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2017-11-14 |
| 9631919 | Non-contact sheet resistance measurement of barrier and/or seed layers prior to electroplating | Abraham Ravid, Dmitry A. Dzilno, Robert O. Miller | 2017-04-25 |
| 9620379 | Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2017-04-11 |
| 9490154 | Method of aligning substrate-scale mask with substrate | Abraham Ravid, Paul Connors, Sergey Starik, Ganesh Balasubramanian | 2016-11-08 |
| 9458537 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2016-10-04 |
| 9443714 | Methods and apparatus for substrate edge cleaning | James M. Holden, Song-Moon Suh, Kalyanjit Ghosh, Leon Volfovski, Michael R. Rice +1 more | 2016-09-13 |
| 9429247 | Acoustically-monitored semiconductor substrate processing systems and methods | Kommisetti Subrahmanyam, Joseph Yudovsky, Michael W. Johnson | 2016-08-30 |
| 9405287 | Apparatus and method for optical calibration of wafer placement by a robot | Abraham Ravid, Eran Weiss, Michael R. Rice, Izya Kremerman | 2016-08-02 |