Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9335151 | Film measurement | Edward W. Budiarto, Dmitry A. Dzilno | 2016-05-10 |
| 9252057 | Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2016-02-02 |
| 9218992 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, James M. Holden +1 more | 2015-12-22 |
| 9177864 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2015-11-03 |
| 9157730 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2015-10-13 |
| 9048309 | Uniform masking for wafer dicing using laser and plasma etch | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-06-02 |
| 9029242 | Damage isolation by shaped beam delivery in laser scribing process | James M. Holden, Nir Merry | 2015-05-12 |
| 8969177 | Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film | Mohammad Kamruzzaman Chowdhury, Wei-Sheng Lei, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-03-03 |
| 8946057 | Laser and plasma etch wafer dicing using UV-curable adhesive film | Wei-Sheng Lei, Mohammad Kamruzzaman Chowdhury, Brad Eaton, Madhava Rao Yalamanchili, Ajay Kumar | 2015-02-03 |
| 8940619 | Method of diced wafer transportation | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Saravjeet Singh, Ajay Kumar +1 more | 2015-01-27 |
| 8912077 | Hybrid laser and plasma etch wafer dicing using substrate carrier | Saravjeet Singh, Brad Eaton, Ajay Kumar, Wei-Sheng Lei, James M. Holden +1 more | 2014-12-16 |
| 8859397 | Method of coating water soluble mask for laser scribing and plasma etch | Wei-Sheng Lei, Brad Eaton, Aparna Iyer, Madhava Rao Yalamanchili, Ajay Kumar | 2014-10-14 |
| 8698889 | Metrology system for imaging workpiece surfaces at high robot transfer speeds | Abraham Ravid, Karen Lingel, Mitchell DiSanto, Hari Kishore Ambal, Edward W. Budiarto | 2014-04-15 |
| 8620064 | Method for imaging workpiece surfaces at high robot transfer speeds with reduction or prevention of motion-induced distortion | Abraham Ravid, Karen Lingel | 2013-12-31 |
| 8557682 | Multi-layer mask for substrate dicing by laser and plasma etch | James M. Holden, Wei-Sheng Lei, Brad Eaton, Saravjeet Singh | 2013-10-15 |
| 8452077 | Method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion | Abraham Ravid, Karen Lingel | 2013-05-28 |
| 8123881 | Die-to-robot alignment for die-to-substrate bonding | Damon K. Cox, Michael Yang, Jeffrey C. Hudgens | 2012-02-28 |
| 8078304 | Dual-mode robot systems and methods for electronic device manufacturing | Michael R. Rice, Jeffrey C. Hudgens, Ingrid B. Peterson | 2011-12-13 |
| 7969568 | Spectrographic metrology of patterned wafers | James M. Holden, Edgar Genio | 2011-06-28 |