Issued Patents All Time
Showing 151–175 of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754791 | Selective deposition utilizing masks and directional plasma treatment | Yin Fan, Ellie Yieh, Srinivas D. Nemani | 2017-09-05 |
| 9748148 | Localized stress modulation for overlay and EPE | Ellie Yieh, Huixiong Dai, Srinivas D. Nemani, Christopher Dennis Bencher | 2017-08-29 |
| 9733579 | Tooling configuration for electric/magnetic field guided acid profile control in a photoresist layer | Sang Ki Nam, Peng Xie, Qiwei Liang | 2017-08-15 |
| 9716005 | Plasma poisoning to enable selective deposition | Srinivas D. Nemani, Tobin Kaufman-Osborn | 2017-07-25 |
| 9620407 | 3D material modification for advanced processing | Srinivas D. Nemani, Erica Chen, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-04-11 |
| 9620335 | In situ control of ion angular distribution in a processing apparatus | Costel Biloiu, Nini Munoz, Anthony Renau | 2017-04-11 |
| 9613859 | Direct deposition of nickel silicide nanowire | Annamalai Lakshmanan, Bencherki Mebarki, Kaushal K. Singh, Paul F. Ma, Mehul Naik +1 more | 2017-04-04 |
| 9595467 | Air gap formation in interconnection structure by implantation process | Jun Xue, Erica Chen, Srinivas D. Nemani, Ellie Yieh | 2017-03-14 |
| 9553174 | Conversion process utilized for manufacturing advanced 3D features for semiconductor device applications | Christopher R. Hatem, Matthew D. Scotney-Castle, Martin A. Hilkene | 2017-01-24 |
| 9534289 | Plasma process chambers employing distribution grids having focusing surfaces thereon enabling angled fluxes to reach a substrate, and related methods | Jun Xue, Qiwei Liang | 2017-01-03 |
| 9528185 | Plasma uniformity control by arrays of unit cell plasmas | Sang Ki Nam, Tae Seung Cho, Srinivas D. Nemani | 2016-12-27 |
| 9530674 | Method and system for three-dimensional (3D) structure fill | Ellie Yieh, Srinivas D. Nemani, Er-Xuan Ping, Gary E. Dickerson | 2016-12-27 |
| 9520267 | Bias voltage frequency controlled angular ion distribution in plasma processing | Jun Xue, Prashanth Kothnur, Umesh M. Kelkar, Matthew D. Scotney-Castle | 2016-12-13 |
| 9515166 | Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications | Srinivas D. Nemani, Ellie Yieh, Yin Fan | 2016-12-06 |
| 9512517 | Multiple exposure treatment for processing a patterning feature | Tristan Y. Ma, Maureen Petterson, John Hautala | 2016-12-06 |
| 9514918 | Guard aperture to control ion angular distribution in plasma processing | Sang Ki Nam | 2016-12-06 |
| 9502258 | Anisotropic gap etch | Jun Xue, Ching-Mei Hsu, Zihui Li, Anchuan Wang, Nitin K. Ingle | 2016-11-22 |
| 9502262 | Nanocrystalline diamond carbon film for 3D NAND hardmask application | Yongmei Chen, Christopher S. Ngai, Jingjing Liu, Jun Xue, Chentsau Ying | 2016-11-22 |
| 9480140 | Material modification by neutral beam source with selected collision angle | Sang Ki Nam | 2016-10-25 |
| 9460961 | Techniques and apparatus for anisotropic metal etching | Thomas R. Omstead, Tristan Y. Ma | 2016-10-04 |
| 9425027 | Methods of affecting material properties and applications therefor | Christopher R. Hatem, Deepak A. Ramappa, Xianfeng Lu, Anthony Renau, Patrick M. Martin | 2016-08-23 |
| 9412613 | Development of high etch selective hardmask material by ion implantation into amorphous carbon films | Pramit Manna, Abhijit Basu Mallick, Yongmei Chen, Jun Xue, Mukund Srinivasan +2 more | 2016-08-09 |
| 9396965 | Techniques and apparatus for anisotropic metal etching | Tristan Y. Ma, Thomas R. Omstead | 2016-07-19 |
| 9382625 | Remote plasma source based cyclic CVD process for nanocrystalline diamond deposition | Jun Xue, Jingjing Liu, Yongmei Chen, Chentsau Ying, Shambhu N. Roy | 2016-07-05 |
| 9385219 | Method and apparatus for selective deposition | Ellie Yieh, Srinivas D. Nemani, Yin Fan, Tristan Y. Ma | 2016-07-05 |