Issued Patents All Time
Showing 126–150 of 241 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10203604 | Method and apparatus for post exposure processing of photoresist wafers | Viachslav Babayan, Douglas A. Buchberger, Jr., Qiwei Liang, Srinivas D. Nemani, Daniel J. Woodruff +2 more | 2019-02-12 |
| 10204764 | Methods for forming a metal silicide interconnection nanowire structure | Bencherki Mebarki, Annamalai Lakshmanan, Kaushal K. Singh, Andrew Cockburn, Paul F. Ma +1 more | 2019-02-12 |
| 10192775 | Methods for gapfill in high aspect ratio structures | Pramit Manna, Rui Cheng, Erica Chen, Ziqing Duan, Abhijit Basu Mallick +1 more | 2019-01-29 |
| 10167574 | Porous surface for biomedical devices | Sangmin JEONG, Hann-Ching Chao | 2019-01-01 |
| 10157740 | Selective deposition process utilizing polymer structure deactivation process | Christine Y Ouyang | 2018-12-18 |
| 10108093 | Controlling photo acid diffusion in lithography processes | Peng Xie, Christopher Dennis Bencher | 2018-10-23 |
| 10096512 | Gapfill film modification for advanced CMP and recess flow | Erica Chen, Srinivas D. Nemani, Ellie Yieh | 2018-10-09 |
| 10096466 | Pulsed plasma for film deposition | Jun Xue, Srinivas D. Nemani, Michael W. Stowell, Qiwei Liang, Douglas A. Buchberger, Jr. | 2018-10-09 |
| 10048589 | Field guided post exposure bake application for photoresist microbridge defects | Sang Ki Nam, Christine Y Ouyang | 2018-08-14 |
| 9996006 | Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake | Christine Y Ouyang, Sang Ki Nam | 2018-06-12 |
| 9964863 | Post exposure processing apparatus | Viachslav Babayan, Kyle M. Hanson, Robert B. Moore | 2018-05-08 |
| 9947539 | Plasma poisoning to enable selective deposition | Srinivas D. Nemani, Tobin Kaufman-Osborn | 2018-04-17 |
| 9927709 | Resist sensitivity and profile improvement via acid anion control during field-guided post exposure bake | Christine Y Ouyang, Sang Ki Nam | 2018-03-27 |
| 9911594 | Selective atomic layer deposition process utilizing patterned self assembled monolayers for 3D structure semiconductor applications | Srinivas D. Nemani, Ellie Yieh, Yin Fan | 2018-03-06 |
| 9865464 | Nanocrystalline diamond carbon film for 3D NAND hardmask application | Yongmei Chen, Christopher S. Ngai, Jingjing Liu, Jun Xue, Chentsau Ying | 2018-01-09 |
| 9864276 | Laser annealing and electric field | Christine Y Ouyang, Sang Ki Nam | 2018-01-09 |
| 9850569 | Ion implantation for superconductor tape fabrication | Connie P. Wang, Paul J. Murphy, Paul Sullivan, Frank Sinclair, Morgan Evans | 2017-12-26 |
| 9852902 | Material deposition for high aspect ratio structures | Jun Xue, Martin A. Hilkene, Matthew D. Scotney-Castle | 2017-12-26 |
| 9829790 | Immersion field guided exposure and post-exposure bake process | Douglas A. Buchberger, Jr., Sang Ki Nam, Viachslav Babayan, Christine Y Ouyang, Srinivas D. Nemani | 2017-11-28 |
| 9823570 | Field guided post exposure bake application for photoresist microbridge defects | Sang Ki Nam, Christine Y Ouyang | 2017-11-21 |
| 9815091 | Roll to roll wafer backside particle and contamination removal | Christopher S. Ngai, Huixiong Dai, Ellie Yieh | 2017-11-14 |
| 9798240 | Controlling photo acid diffusion in lithography processes | Peng Xie, Christopher Dennis Bencher | 2017-10-24 |
| 9777378 | Advanced process flow for high quality FCVD films | Srinivas D. Nemani, Erica Chen, Jun Xue, Ellie Yieh | 2017-10-03 |
| 9773675 | 3D material modification for advanced processing | Srinivas D. Nemani, Erica Chen, Jun Xue, Ellie Yieh, Gary E. Dickerson | 2017-09-26 |
| 9767987 | Method and system for modifying substrate relief features using ion implantation | Patrick M. Martin, Timothy J. Miller, Vikram Singh | 2017-09-19 |