Issued Patents 2018
Showing 101–125 of 148 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991224 | Bump-on-trace interconnect having varying widths and methods of forming same | Chen-Shien Chen | 2018-06-05 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Shih-Peng Tai | 2018-05-29 |
| 9985336 | Antenna apparatus and method | Lai Wei Chih, Monsen Liu, En-Hsiang Yeh, Chuei-Tang Wang | 2018-05-29 |
| 9984999 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Dean Wang, Mirng-Ji Lii | 2018-05-29 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9984981 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou +1 more | 2018-05-29 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung +1 more | 2018-05-22 |
| 9972581 | Routing design of dummy metal cap and redistribution line | Hsien-Wei Chen, Meng-Tsan Lee, Tsung-Shu Lin, Wei-Cheng Wu, Chien-Chia Chiu +1 more | 2018-05-15 |
| 9969614 | MEMS packages and methods of manufacture thereof | Kuo-Chung Yee | 2018-05-15 |
| 9966336 | Hybrid interconnect scheme and methods for forming the same | Tien-I Bao | 2018-05-08 |
| 9966360 | Semiconductor package and manufacturing method thereof | Chun-Hui Yu, Kuo-Chung Yee | 2018-05-08 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2018-05-01 |
| 9960088 | End point detection in grinding | Yi-Chao Mao, Jui-Pin Hung, Jing-Cheng Lin, Shin-Puu Jeng | 2018-05-01 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2018-04-24 |
| 9953892 | Polymer based-semiconductor structure with cavity | Hung-Yi Kuo, Hao-Yi Tsai | 2018-04-24 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Shin-Puu Jeng, Jui-Pin Hung, Hsien-Wen Liu | 2018-04-24 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu, Shih-Wei Liang, Chang-Pin Huang +2 more | 2018-04-17 |
| 9935197 | Semiconductor devices with low junction capacitances | Cheng-Hung Chang, Yu-Rung Hsu | 2018-04-03 |
| 9935090 | Substrate design for semiconductor packages and method of forming same | Jung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee | 2018-04-03 |
| 9929118 | Packaging through pre-formed metal pins | Chien Ling Hwang, Yeong-Jyh Lin | 2018-03-27 |
| 9929126 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2018-03-27 |
| 9929112 | Semiconductor device and method of manufacture | Cheng-Hsien Hsieh, Hsien-Wei Chen, Tsung-Shu Lin, Wei-Cheng Wu | 2018-03-27 |
| 9922943 | Chip-on-substrate packaging on carrier | Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |
| 9917072 | Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process | Kuo-Chung Yee, Hao-Yi Tsai, Tin-Hao Kuo | 2018-03-13 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |