Issued Patents 2018
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163711 | Methods of packaging semiconductor devices including placing semiconductor devices into die caves | Jing-Cheng Lin, Yi-Hang Lin, Tsan-Hua Tung | 2018-12-25 |
| 10163876 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Feng-Cheng Hsu | 2018-12-25 |
| 10163860 | Semiconductor package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2018-12-25 |
| 10163857 | Multi-chip fan out package and methods of forming the same | Chen-Hua Yu, Jing-Cheng Lin | 2018-12-25 |
| 10163841 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Der-Chyang Yeh | 2018-12-25 |
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Der-Chyang Yeh, Chiung-Han Yeh | 2018-12-11 |
| 10128175 | Packaging methods and packaged semiconductor devices | Jing-Cheng Lin | 2018-11-13 |
| 10083946 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Li-Hui Cheng, Jing-Cheng Lin | 2018-09-25 |
| 10079225 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jing-Cheng Lin, Li-Hui Cheng | 2018-09-18 |
| 10079159 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jing-Cheng Lin, Li-Hui Cheng | 2018-09-18 |
| 10074637 | Structure and formation method for chip package | Cheng-Lin Huang, Hsien-Wen Liu, Shin-Puu Jeng | 2018-09-11 |
| 10062662 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jing-Cheng Lin | 2018-08-28 |
| 10049989 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jing-Cheng Lin | 2018-08-14 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Chien Ling Hwang | 2018-08-14 |
| 10050024 | Semiconductor package and manufacturing method of the same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng | 2018-08-14 |
| 10032725 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2018-07-24 |
| 10008463 | Wafer-level packaging mechanisms | Jing-Cheng Lin | 2018-06-26 |
| 9997471 | Semiconductor package structure and manufacturing method thereof | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, De-Dui Liao | 2018-06-12 |
| 9985006 | Semiconductor structure and manufacturing method thereof | Shin-Puu Jeng, Feng-Cheng Hsu | 2018-05-29 |
| 9978657 | Semiconductor package device and manufacturing method thereof | Nai-Wei Liu, Jing-Cheng Lin | 2018-05-22 |
| 9960088 | End point detection in grinding | Yi-Chao Mao, Jing-Cheng Lin, Shin-Puu Jeng, Chen-Hua Yu | 2018-05-01 |
| 9960125 | Method of forming a semiconductor package | Jing-Cheng Lin, Chin-Chuan Chang | 2018-05-01 |
| 9950450 | Molding chamber apparatus and curing method | Jing-Cheng Lin, Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wen Liu | 2018-04-24 |
| 9953955 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jing-Cheng Lin | 2018-04-24 |
| 9935080 | Three-layer Package-on-Package structure and method forming same | Feng-Cheng Hsu, Shin-Puu Jeng | 2018-04-03 |