Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163709 | Semiconductor device and method | Chen-Hua Yu, Yi-Hsiu Chen, Ku-Feng Yang, Wen-Chih Chiou | 2018-12-25 |
| 10163756 | Isolation structure for stacked dies | Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2018-12-25 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2018-08-14 |
| 9978607 | Through via structure and method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2018-05-22 |