Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163756 | Isolation structure for stacked dies | Hung-Pin Chang, Chen-Shien Chen, Wen-Chih Chiou, Chen-Hua Yu | 2018-12-25 |
| 9984981 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Wei-Cheng Wu, Ping-Kang Huang, Shang-Yun Hou, Shin-Puu Jeng +1 more | 2018-05-29 |