Issued Patents 2018
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163497 | Three dimensional dual-port bit cell and method of using same | Wei Min Chan, Yen-Huei Chen | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Hsien-Wei Chen +1 more | 2018-12-25 |
| 10164074 | Semiconductor device with gate electrode embedded in substrate | Li-Feng Teng, Alexander Kalnitsky | 2018-12-25 |
| 10163919 | Embedded flash memory device with floating gate embedded in a substrate | Harry-Hak-Lay Chuang | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu | 2018-12-25 |
| 10163802 | Fan-out package having a main die and a dummy die, and method of forming | Yan-Fu Lin, Chen-Hua Yu, Meng-Tsan Lee, Hsien-Wei Chen | 2018-12-25 |
| 10163522 | Test line letter for embedded non-volatile memory technology | Jui-Tsung Lien, Fang-Lan Chu, Hong-Da Lin, Ku-Ning Chang, Yu-Chen Wang | 2018-12-25 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh +1 more | 2018-12-18 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh | 2018-12-18 |
| 10147794 | Split gate memory device and method of fabricating the same | Chang-Ming Wu, Shih-Chang Liu, Harry-Hak-Lay Chuang, Chia-Shiung Tsai | 2018-12-04 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh | 2018-11-27 |
| 10134743 | Structure and method for statice random access memory device of vertical tunneling field effect transistor | Harry-Hak-Lay Chuang, Bao-Ru Young, Ming Zhu, Yi-Ren Chen | 2018-11-20 |
| 10090213 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Shang-Yun Hou +1 more | 2018-10-02 |
| 10068773 | Contact formation for split gate flash memory | Harry-Hak-Lay Chuang, Ya-Chen Kao, Chin-Yi Huang | 2018-09-04 |
| 10062419 | Digtial circuit structures | Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen, Hung-Jen Liao | 2018-08-28 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10056347 | Bump structure for yield improvement | Tzu-Wei Chiu, Tzu-Yu Wang, Shang-Yun Hou, Shin-Puu Jeng, Hsien-Wei Chen +1 more | 2018-08-21 |
| 10049898 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Chien-Fu Tseng | 2018-08-14 |
| 10050050 | Semiconductor device with metal gate memory device and metal gate logic device and method for manufacturing the same | Harry-Hak-Lay Chuang, Ya-Chen Kao | 2018-08-14 |
| 10032786 | Semiconductor device and manufacturing method thereof | Jui-Tsung Lien | 2018-07-24 |
| 10026741 | Logic-compatible memory cell manufacturing method and structure thereof | Ming Chyi Liu, Yu-Hsing Chang, Shih-Chang Liu | 2018-07-17 |
| 9997235 | Semiconductor memory with respective power voltages for plurality of memory cells | Chih-Yu Lin, Kao-Cheng Lin, Wei Min Chan, Yen-Huei Chen | 2018-06-12 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9988264 | Method of fabricating integrated structure for MEMS device and semiconductor device | Bang-Chiang Lan, Li-Hsun Ho, Hui-Min Wu, Min Chen, Tzung-I Su +1 more | 2018-06-05 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |