CT

Chien-Fu Tseng

TSMC: 1 patents #1,476 of 2,904Top 55%
Overall (2018): #454,639 of 503,207Top 95%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10049898 Semiconductor device packages, packaging methods, and packaged semiconductor devices Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Der-Chyang Yeh, Wei-Cheng Wu 2018-08-14