Issued Patents 2018
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163661 | Stacked semiconductor devices and methods of forming same | Hsien-Wei Chen, Li-Hsien Huang | 2018-12-25 |
| 10165682 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Wei Chen, Li-Han Hsu +1 more | 2018-12-25 |
| 10163861 | Semiconductor package for thermal dissipation | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2018-12-25 |
| 10163841 | Multi-chip package and method of formation | Jing-Cheng Lin, Chen-Hua Yu, Jui-Pin Hung | 2018-12-25 |
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Hsien-Wei Chen, Shih-Peng Tai | 2018-12-25 |
| 10163805 | Package structure and method for forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu | 2018-12-25 |
| 10163803 | Integrated fan-out packages and methods of forming the same | Wei-Yu Chen, An-Jhih Su, Li-Hsien Huang, Ming-Shih Yeh | 2018-12-25 |
| 10157852 | Multi-stacked package-on-package structures | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Ming-Shih Yeh, Wei-Cheng Wu | 2018-12-18 |
| 10157899 | Packages and methods of forming packages | Chen-Hua Yu, An-Jhih Su | 2018-12-18 |
| 10157825 | Dummy metal with zigzagged edges | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Li-Han Hsu +1 more | 2018-12-18 |
| 10153205 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Chen-Hua Yu, Shang-Yun Hou, Wen-Chih Chiou, Jui-Pin Hung, Chiung-Han Yeh | 2018-12-11 |
| 10153338 | Method of manufacturing a capacitor | Chun Hua Chang, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2018-12-11 |
| 10141288 | Surface mount device/integrated passive device on package or device structure and methods of forming | Cheng-Hsien Hsieh, Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu | 2018-11-27 |
| 10083940 | Package-on-package semiconductor device | Chen-Hua Yu | 2018-09-25 |
| 10074631 | Packages and packaging methods for semiconductor devices, and packaged semiconductor devices | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, An-Jhih Su | 2018-09-11 |
| 10062648 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +2 more | 2018-08-28 |
| 10049898 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Chen-Hua Yu, Wei-Cheng Wu, Chien-Fu Tseng | 2018-08-14 |
| 10037963 | Package structure and method of forming the same | Jie Chen, Chen-Hua Yu, Hsien-Wei Chen | 2018-07-31 |
| 10037892 | Multi-chip structure and method of forming same | Chen-Hua Yu | 2018-07-31 |
| 10026704 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Hsien-Wei Chen, Jie Chen | 2018-07-17 |
| 9997464 | Dummy features in redistribution layers (RDLS) and methods of forming same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Chi-Hsi Wu +1 more | 2018-06-12 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2018-05-29 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Shih-Peng Tai | 2018-05-29 |
| 9960106 | Package with metal-insulator-metal capacitor and method of manufacturing the same | Shuo-Mao Chen, Chiung-Han Yeh | 2018-05-01 |
| 9929126 | Packages with metal line crack prevention design | Chen-Hua Yu, Shin-Puu Jeng, Hsien-Wei Chen, Jie Chen | 2018-03-27 |