Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163807 | Alignment pattern for package singulation | Ying-Ju Chen, Der-Chyang Yeh, Hsien-Wei Chen | 2018-12-25 |
| 10163822 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2018-12-25 |
| 9984969 | Semiconductor devices, multi-die packages, and methods of manufacure thereof | Chen-Hua Yu, Hsien-Wei Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh | 2018-05-29 |
| 9922943 | Chip-on-substrate packaging on carrier | Chen-Hua Yu, Tzu-Shiun Sheu, Shin-Puu Jeng, An-Jhih Su, Chi-Hsi Wu | 2018-03-20 |