YC

Ying-Ju Chen

TSMC: 15 patents #77 of 2,904Top 3%
Overall (2018): #2,538 of 503,207Top 1%
15
Patents 2018

Issued Patents 2018

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
10163807 Alignment pattern for package singulation Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai 2018-12-25
10163866 Semiconductor device and method of manufacture Hsien-Wei Chen, An-Jhih Su, Jie Chen 2018-12-25
10157892 Semiconductor packages and methods of forming the same Hsien-Wei Chen, Wen-Chih Chiou 2018-12-18
10157867 Interconnect structure and method Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Chih-Chia Hu 2018-12-18
10074584 Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer Hsien-Wei Chen 2018-09-11
10074618 Semiconductor structure and manufacturing method thereof Hsien-Wei Chen, Ming-Fa Chen 2018-09-11
10037953 Contact pad for semiconductor devices Jie Chen, Hsien-Wei Chen 2018-07-31
10032712 Semiconductor structure Hsien-Wei Chen 2018-07-24
10008413 Wafer level dicing method Hsien-Wei Chen 2018-06-26
9997480 Method of forming a semiconductor device including strain reduced structure Hsien-Wei Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang 2018-06-12
9991247 Semiconductor device packages, packaging methods, and packaged semiconductor devices Jie Chen, Hsien-Wei Chen 2018-06-05
9984998 Devices employing thermal and mechanical enhanced layers and methods of forming same Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more 2018-05-29
9978704 Semiconductor devices with ball strength improvement Tsung-Yuan Yu, Hsien-Wei Chen, Shih-Wei Liang 2018-05-22
9911707 Structure and method of forming a pad structure having enhanced reliability Hsien-Wei Chen 2018-03-06
9859235 Underbump metallization structure Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Shang-Yun Hou +2 more 2018-01-02